HB paper base copper clad plate

Column:HB paper base copper clad plate
Paper - based copper clad plate is a popular name for domestic sales, its professional name is XPC.

FUJIAN LIHAO ELECTRONIC TECHNOLOGY CO., LTD.

Xiamei Town, Nanan city, Fujian Province

TEL:0595-86785298 FAX:0595-86785296

XPC TDS

Paper - based copper clad plate is a popular name for domestic sales, its professional name is XPC.

XPC Single Sided

XPC is a phenolic resin copper clad laminate, with good moisture resistance, heat resistance and dimensional stability, and suitable for low temperature punching operations.

xpc is a paper based phenonlic resin copper clad laminate.It has good heat and humidity resistance and is suitable for cold punching.

The level of Grade and Construction

Type

Grade

Construction

HB

CPFCP-04

Paper,Phenolic  resin, copper foil

 Feature

Low cost but with wide range of application

Warpage and twist are small and stable

Suttable for punching at 40℃-70℃

Light color for easy circuit inspection

Standard configuration

Thickness :0.8mm-1.6mm

Regular Size(mm):1030*1230

Other Size:As specified by customers

General Propertie

NO.

Item

Unit

Test Condition

Standard Value

Typical Value

1

260℃)

Solder resistance

SecA1024
2

Peel Strength

(Copper Foil 25μm)

Kf/cmA1.21.41
3

Fleural Strength

MPaLengthwise82

146

Crosswise

72

115

4

Water Absorption

%E-24+D-24/2321.7
5

Surface Resistance

MΩC-96/40/90104

3.8 *104

6

Volume Resistivity

MΩ.cmC-96/40/90106

4.1*106

7

1MHz

Dielectric Constant

-C-96/40/90

5.6

4.8


8

1MHz

Dissipation Factor


C-96/40/90

0.050

0.039



10


Chemical Resistance


3%NaOH

40℃ 3min


No change


No change


Remark:1.  The test methods are according to GB/T 4722-2017

          2.  Packing, marking, transportation and storage shall be in accordance with GB/T 4721

          3.  Specimen Thickness:1.6mm, Typical values for reference only




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