Cem-1 composite base copper clad plate

Column:Cem-1 composite base copper clad plate
Cem-1 is a composite base (paper, glass fiber cloth) copper clad laminate, with good moisture resistance, heat resistance and dimensional stability, and suitable for low temperature punching operations.

FUJIAN LIHAO ELECTRONIC TECHNOLOGY CO., LTD.

Xiamei Town, Nanan city, Fujian Province

TEL:0595-86785298 FAX:0595-86785296

CEM-1 TDS

CEM-1Single Sided

CEM-1 is a composite substrate (paper, fiberglass cloth) copper clad laminate with excellent performance in flame resistance and dimensional stability.It has good heat and humidity resistance and is suitable for cold punching.

Grade and Construction

Type

Grade

Construction

L-40F

CPFCP(G)-23F

Paper,Phenolic  resin,epoxy resin,fiberglass cloth,copper foil

Feature

  Low cost but with wide range of application

  Warpage and twist are small and stable

  Suttable for punching at 50℃-90℃

  Excellent heat and humidity resistance

  Excellent dimensional stability

Standard configuration

Thickness :0.8mm-1.6mm

Regular Size(mm) :1030*1230

Other Size:As specified by customers

General Propertie

NO.

Item

Unit

Test Condition

Standard Value

Typical Value

1

260℃)

Solder resistance

 SecA1062
2

Peel Strength

(Copper Foil 25μm)

N/mm

A1.21.4-1.6
3

Fleural Strength

MPa

warp

≥242293

fill

≥172214
4

Water Absorption

%E-24+D-24/23≤0.50.39
5

Surface Resistance

MΩC-96/40/90

1.0*104

3.5*104

6

Volume Resistivity

MΩ.cmC-96/40/90

1.0*106

6.3*106

7

1MHz

Dielectric Constant

-C-96/40/90≤5.44.5
8

1MHz

Dissipation Factor


C-96/40/90≤0.0350.031
9


Flammability

SecUL94FV-0FV-0
10

Punching Temperature


Ambient -90

NO CRACK

OK
注 Remark:1.The test methods are according to GB/T 4722-2017

                  2.Packing, marking, transportation and storage shall be in accordance with GB/T 4721

                 3. Specimen Thickness:1.6mm, Typical values for reference only