22F composite base copper clad plate

Column:22F composite base copper clad plate
22F is a composite base (paper, glass fiber cloth) copper clad laminate with good moisture resistance, heat resistance and dimensional stability, and suitable for low temperature punching operations.

FUJIAN LIHAO ELECTRONIC TECHNOLOGY CO., LTD.

Xiamei Town, Nanan city, Fujian Province

TEL:0595-86785298 FAX:0595-86785296

22F TDS

22F Single Sided

22F is a composite substrate (paper, fiberglass cloth) copper clad laminate with excellent performance in flame resistance and dimensional stability.It has good heat and humidity resistance and is suitable for cold punching.

Grade and Construction

Type

Grade

Construction

22F

CPFCP-22F

Paper,Phenolic  resin,epoxy resin,fiberglass cloth,copper foil

Feature

  Low cost but with wide range of application

  Warpage and twist are small and stable

  Suttable for punching at 50℃-90℃

  Excellent heat and humidity resistance

  Excellent dimensional stability

Standard configuration

Thickness :0.8mm-1.6mm

Regular Size(mm)         :1030*1230

 Other Size          :As specified by customers

 General Properties

NO.

Item

Unit

Test Condition

Standard Value

Typical Value

1

260℃)

Solder resistance

/SecA1045
2


Peel Strength

(Copper Foil 25μm)

Kf/cmA1.21.4-1.8
3

Fleural Strength

MPawarp≥230268
fill≥172210
4

Water Absorption

%E-24+D-24/23≤0.5

0.44

5

Surface Resistance

MΩC-96/40/90

104

3.5*104

6

Volume Resistivity

MΩ.cmC-96/40/90

106

4*106

7

1MHz

Dielectric Constant

-C-96/40/90≤5.44.6
8

1MHz

Dissipation Factor


C-96/40/90≤0.0350.03
9

Flammability

SecUL94FV-1FV-1
10

Chemical Resistance


3%NaOH

40℃ 3min


No change


No change

11

Punching Temperature


-90

Ambient -90

50-90

 Remark:
1.The test methods are according to GB/T 4722-2017

2.Packing, marking, transportation and storage shall be in accordance with GB/T 4721

3.Specimen Thickness:1.6mm, Typical values for reference only